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Manual de usuario Henkel, modelo SubFloor

Fabricar: Henkel
Tamaño del archivo: 352.19 kb
Nombre del archivo: b506d31e-b2bb-4896-9dc6-c52ec32c13e8.pdf
Idioma del manual:en
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Resumen del manual


GENERAL INFORMATION (NEW SUBFLOORS OR RENOVATION) The subfloor must be absolutely hard, level, dry, smooth and structurally sound. The subfloor must be free of cracks and other irregularities and must not be contaminated with paint, plaster, oil, grease or any other substance which could affect adhesion. Cracks must be filled with an appropriate material. The following information provides you with basic installation procedures. For technical products or more detailed instructions please refer to our technical guide. 171 Tiles 172 Sheet 173 Saga 174 Conductive, dissipative and antistatic floorcoverings 174 Conductive flooring with conductive adhesive and conductive primer 175 Laying procedure for residential sheet products 168 to 175 Laying procedures 176 Cold and hot welding 177 Adhesives 178 to 181 Maintenance Technical guide Technical guide Technical guide 171 170Technicalguide Laying procedure for tiles Technical guide Hardness Use cement based products for subfloor preparation. They must be neither crumbly nor flaky. Flatness Maximum deflexion, for a 2 m ruler 7 mm, for a 0.20 m ruler 2 mm. Surface state: fine and regular. Dryness Moisture content in subfloors should be measured using appropriate devices and should be in accordance with relevant standards in each country. The relative humidity must not be higher than 75 % R.H. Adapt the drying time according to how cold or damp the conditions are. Smoothness A smoothing compound must be applied to the entire surface according to the standards mentioned above. Smoothing compounds are not designed to overcome levelling deficiencies. The smoothing compound must be allowed to dry in accordance with manufacturer's instructions. Rub down using a carborundum stone in order to obtain a perfectly smooth surface. Sweep or vacuum up any dust. Spread the adhesive. Expansion joints or movement joints Floorcovering should be laid up to the joint and the joint should be covered with an appropriate plastic or metal sliding joint cover. Subfloors direct to ground A damp-proof membrane must be laid under the concrete to act as a waterproof barrier against underlying hydrostatic pressure and moisture. Underfloor heating The subfloor must be allowed to dry in accordance with local standards. The heating system should have been switched on at least 4 weeks before laying the floorcovering, then switched off 24 hours before any subfloor preparation, and remains switched off during installation of the floorcovering. The heating should then be switched on 48 hours after installation of the flooring and the temperature progressively increased to normal working temperatures over 5-7 days. Glueline temperature < 28 °C (contact technical department for further information.) Old carpeting Remove, clean the subfloor and apply a smoothing compound. Wooden floorboards Check the condition of the floorboards, secure any loose boards. Any knotholes to be filled as necessary. Cover with hardboard, chipboard or plywood, minimum thickness 8 mm. These sheets should be nailed or stapled every 10-15 cms. Check that the floorboards are dry and ventilated on the underside. All non ventilated woodenfloors must be removed. Ceramic tiles Any loose tiles must be stuck down and any traces of paint, plaster, grease, etc, must be removed. The cleaned tiles must be primed with an appropriate primer prior to applying a smoothing compound fully in accordance with manufacturers instructions. Leave to dry then rub down to a smooth finish. Sweep thoroughly. Apply the adhesive in accordance with manufacturers instructions. Old vinyl flooring Old vinyl, linoleum and rubber floorcoverings should always be removed and the subfloor be examined and prepared as necessary before installing new floorcoverings. Technical guide Technicalguide 1. Trace a line perpendicular to the main entrance. Trace a perpendicular line to this axis ensuring equal cuts for tiles on both sides. 2. Apply adhesive to a few square metres of subfloor in one quarter. Insufficient open time of the adhesive will cause bubbles. If open time is too long the adhesive transfer will be poor. 3. Press each tile into position ensuring joints are butted tight. Beware installation directions according to pattern. 4. Smooth down manually then roll with a 50 kg flooring roller. 5. If necessary heat weld seams 24 hours after installation. Do not traffic the floorcovering for 48 hours after installation. Unpack the tiles 24 hours before laying and make sure they are stacked horizontally. Minimum ambiant temperature must be 15 °C. 170Technicalguide Laying procedure for tiles Technical guide Hardness Use cement based products for subfloor preparation. They must be neither crumbly nor flaky. Flatness Maximum deflexion, for a 2 m ruler 7 mm, for a 0.20 m ruler 2 mm. Surface state: fine and regular. Dryness Moisture content in subfloors should be measured using appropriate devices and should be in accordance with relevant standards in each country. The relative...


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