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Resumen del manual
Box 5405 Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 Japan: Freescale Semiconductor Japan Ltd. Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-8573, Japan 81-3-3440-3569 Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong 852-26668334 Home Page: Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Learn More: For more information about Freescale products, please visit Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2004. All rights reserved. Contents About This Book ..................................................................................................................... vi Audience ......................................................................................................................................................vi Organization.................................................................................................................................................vi Conventions ................................................................................................................................................vii Definitions, Acronyms, and Abbreviations.................................................................................................vii References..................................................................................................................................................viii Revision History ........................................................................................................................................viii Chapter 1 Embedded Bootloader Description .................................................................... 1-1 1.1 Target............................................................................................................................................1-1 1.1.1 Ported Targets ...............................................................................................................................1-2 1.2 Features.........................................................................................................................................1-3 1.3 Benefits .........................................................................................................................................1-3 1.4 Potential Issues .............................................................................................................................1-3 1.4.1 Optional Firmware Upload Settings .............................................................................................1-4 Chapter 2 Using the Embedded Bootloader.....................