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Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery. 1.7 Legacy I/O Controller The Legacy I/O Controller provides the following features: • One serial port header • One serial port connector on the back panel • One parallel port connector with Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for Conventional PCI bus systems • PS/2-style keyboard/mouse port • Intelligent power management, including a programmable wake-up event interface • Conventional PCI bus power management support The BIOS Setup program provides configuration options for the Legacy I/O controller. For information about Refer to The location of the headers Figure 11, page 41 The serial port headers signal mapping Table 11, on page 43 1.8 LAN Subsystem The LAN subsystem consists of the following: • Intel NM10 Express Chipset • Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet LAN connectivity • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface that supports the Ethernet controller • Conventional PCI bus power management . Supports ACPI technology . Supports LAN wake capabilities 1.8.1 LAN Subsystem Drivers LAN drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN drivers Section 1.2, page 16 1.8.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4). Figure 4. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is operating. Table 4. LAN Connector LED States LED LED Color LED State Condition Link/Activity (A) Green Off LAN link is not established. On LAN link is established. Blinking LAN activity is occurring. Link Speed (B) Green/Yellow Off 10 Mb/s data rate is selected or negotiated. Green 100 Mb/s data rate is selected or negotiated. Yellow 1000 Mb/s data rate is selected or negotiated. 1.9 Audio Subsystem The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following: • Intel NM10 Express Chipset • Realtek ALC662 audio codec The audio subsystem has the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type. • Front panel Intel HD Audio and AC ’97 audio support. • 3-port analog audio out stack. • Windows Vista Basic certification. • A signal-to-noise (S/N) ratio of 95 dB. Table 5 lists the supported functions of the front panel and back panel audio jacks. Table 5. Audio Jack Support Audio Jack Micro- phone Headphones Line Out (Front Spks) Line In (Stereo 2) Mic-In Front panel – Green Default Front panel – Pink Default Back panel – Blue Default Back panel – Green (ctrl panel) Default Back panel – Pink Default 1.9.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 16 1.9.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors). Item Description A Line in B Line out C Mic in Figure 5. Back Panel Audio Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. For information about Refer to The locations of the front panel audio header and S/PDIF audio header Figure 11, page 41 The signal names of the front panel audio header and S/PDIF header Section 2.2.2.1, page 43 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Thermal monitoring • Voltage monitoring 1.10.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG-P device, which supports the following: • System ambient temperature monitoring • System fan speed monitoring • Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP • SMBus interface 1.10.2 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan header. Item Description A Remote thermal sensor B DTS, located on the processor die C System fan header Figure 6. Thermal Sensors and Fan Header 1.11 Power Management Power management is implemented at several ...