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Resumen del manual
Table of Contents
About This Document.........................................................................................................9
Intended Audience.................................................................................................................................9
Publishing History..................................................................................................................................9
Related Information..............................................................................................................................10
Typographic Conventions.....................................................................................................................11
HP Encourages Your Comments..........................................................................................................12
1 HP Integrity rx7640 Server and HP 9000 rp7440 Server Overview.....................13
Detailed Server Description..................................................................................................................13
Dimensions and Components.........................................................................................................14
Front Panel.......................................................................................................................................17
Front Panel Indicators and Controls..........................................................................................17
Enclosure Status LEDs...............................................................................................................17
Cell Board........................................................................................................................................18
PDH Riser Board........................................................................................................................19
Central Processor Units..............................................................................................................19
Memory Subsystem....................................................................................................................20
DIMMs........................................................................................................................................21
Cells and nPartitions........................................................................................................................21
Internal Disk Devices for the Server................................................................................................22
System Backplane............................................................................................................................23
System Bacplane to PCI-X Backplane Connectivity...................................................................23
Clocks and Reset........................................................................................................................23
I/O Subsystem..................................................................................................................................23
PCI-X/PCIe Backplane................................................................................................................26
PCI-X/PCIe Slot Boot Paths...................................................................................................27
MP/SCSI Board...........................................................................................................................28
LAN/SCSI Board........................................................................................................................28
Mass Storage (Disk) Backplane..................................................................................................28
2 Server Site Preparation................................................................................................29
Dimensions and Weights......................................................................................................................29
Electrical Specifications.........................................................................................................................30
Grounding.......................................................................................................................................30
Circuit Breaker.................................................................................................................................30
System AC Power Specifications.....................................................................................................30
Power Cords...............................................................................................................................30
System Power Specifications......................................................................................................31
Environmental Specifications...............................................................................................................32
Temperature and Humidity............................................................................................................32
Operating Environment.............................................................................................................32
Environmental Temperature Sensor..........................................................................................33
Non-Operating Environment.....................................................................................................33
Cooling.............................................................................................................................................33
Internal Chassis Cooling............................................................................................................33
Bulk Power Supply Cooling.......................................................................................................33
PCI/Mass Storage Section Cooling.............................................................................................33
Standby Cooling.........................................................................................................................33
Typical Power Dissipation and Cooling..........................................................................................33
Table of Contents
3
...Otros modelos de este manual:
Computadoras - HP Integrity rx7640 Server (950.74 kb)