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Resumen del manual
Table of Contents
About this Document..........................................................................................................9
Book Layout............................................................................................................................................9
Intended Audience.................................................................................................................................9
Printing History......................................................................................................................................9
Related Information................................................................................................................................9
Typographic Conventions.....................................................................................................................10
HP Encourages Your Comments..........................................................................................................10
1 Server Expansion Unit Overview................................................................................11
SEU System Backplane.........................................................................................................................12
Core I/O Backplane Module.................................................................................................................13
Core I/O PCA........................................................................................................................................13
Core I/O Boot Paths.........................................................................................................................13
PCI-X Backplane...................................................................................................................................14
PCI-X Slot Boot Paths.......................................................................................................................15
PCI-X/PCIe I/O Backplane....................................................................................................................15
PCI-X/PCIe I/O Backplane Slot Boot Paths .....................................................................................16
Detailed SEU Description.....................................................................................................................17
Internal Disk Devices for the SEU...................................................................................................17
System Backplane ...........................................................................................................................18
Clocks and Reset..............................................................................................................................19
Server Expansion Unit Interconnect................................................................................................19
MP Core I/O Board.....................................................................................................................21
Mass Storage (Disk) Backplane..................................................................................................21
SEU Description...............................................................................................................................22
Dimensions.................................................................................................................................22
System Chassis...........................................................................................................................22
2 Server Site Preparation................................................................................................25
Dimensions and Weights......................................................................................................................25
Electrical Specifications.........................................................................................................................25
Grounding.......................................................................................................................................25
Circuit Breaker.................................................................................................................................26
System AC Power Specifications.....................................................................................................26
Power Cords...............................................................................................................................26
System Power Specifications......................................................................................................26
Environmental Specifications...............................................................................................................27
Temperature and Humidity............................................................................................................27
Operating Environment.............................................................................................................27
Environmental Temperature Sensor..........................................................................................28
Non-Operating Environment.....................................................................................................28
Cooling.............................................................................................................................................28
Internal Chassis Cooling............................................................................................................28
Bulk Power Supply Cooling.......................................................................................................28
PCI/Mass Storage Section Cooling.............................................................................................28
Standby Cooling.........................................................................................................................29
Typical Power Dissipation and Cooling..........................................................................................29
Acoustic Noise Specification...........................................................................................................29
Air Flow...........................................................................................................................................29
Table of Contents
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