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Resumen del manual
This hardcopy is designed to be placed into a standard 3-ring binder. Provided below is a title block that can be copied and cut out and placed into the slip or taped onto the edge of the binder. Technical Reference Guide Technical Reference Guide The information in this document is subject to change without notice. COMPAQ COMPUTER CORPORATION SHALL NOT BE LIABLE FOR TECHNICAL OR EDITORIAL ERRORS OR OMISSIONS HEREIN; NOR FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES RESULTING FROM THE FURNISHING, PERFORMANCE, OR USE OF THIS MATERIAL. IT IS THE RESPONSIBILITY OF MANUFACTURERS TO ENSURE THAT DEVICES DESIGNED TO BE USED WITH COMPAQ PRODUCTS COMPLY WITH FCC CLASS B EMISSIONS REQUIREMENTS. This guide contains information protected by copyright. No part of this document may be photocopied or reproduced in any form without prior written consent from Compaq Computer Corporation. O1997 Compaq Computer Corporation All rights reserved. Printed in the USA Compaq, Deskpro, LTE, Contura, Presario, ProLinea Registered U.S. Patent and Trademark Office Product names mentioned in this document may be trademarks and/or registered trademarks of other companies. For more information regarding specifications and Compaq-specific parts please contact Compaq Computer Corporation, Industry Relations Department. Technical Reference Guide for Compaq Deskpro 4000N and 4000S Personal Computers First Edition - September 1997 Document Number DSK-109A/0907 Compaq Deskpro 4000N and 4000S Personal Computers First Edition – September 1997 Technical Reference Guide Technical Reference Guide Technical Reference Guide Technical Reference GuideS CHAPTER 1 INTRODUCTION............................................................................................................. 1.1 ABOUT THIS GUIDE ........................................................................................................... 1-1 1.1.1 USING THIS GUIDE ..................................................................................................... 1-1 1.1.2 ADDITIONAL INFORMATION SOURCES..................................................................1-1 1.2 NOTATIONAL CONVENTIONS.......................................................................................... 1-2 1.2.1 VALUES........................................................................................................................1-2 1.2.2 RANGES........................................................................................................................ 1-2 1.2.3 SIGNAL LABELS.......................................................................................................... 1-2 1.2.4 REGISTER NOTATION AND USAGE ......................................................................... 1-2 1.2.5 BIT NOTATION............................................................................................................1-2 1.3 COMMON ACRONYMS AND ABBREVIATIONS..............................................................1-3 CHAPTER 2 SYSTEM OVERVIEW..................................................................................................... 2.1 INTRODUCTION.................................................................................................................. 2-1 2.2 FEATURES ........................................................................................................................... 2-2 2.2.1 STANDARD FEATURES .............................................................................................. 2-2 2.2.2 MODEL DIFFERENCES ............................................................................................... 2-3 2.2.3 OPTIONS....................................................................................................................... 2-3 2.3 MECHANICAL DESIGN ...................................................................................................... 2-4 2.3.1 CABINET LAYOUT......................................................................................................2-4 2.3.2 CHASSIS LAYOUT.......................................................................................................2-6 2.3.3 SYSTEM BOARD LAYOUT ......................................................................................... 2-7 2.4 SYSTEM ARCHITECTURE.................................................................................................. 2-8 2.4.1 MICROPROCESSOR................................................................................................... 2-10 2.4.2 MEMORY.................................................................................................................... 2-10 2.4.3 SUPPORT CHIPSET.................................................................................................... 2-11 2.4.4 MASS STORAGE ........................................................................................................ 2-11 2.4.5 SERIAL AND PARALLEL INTERFACES .......................................
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