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Resumen del manual
HP BladeSystem c-Class architecture
Technology brief, 4th edition
Introduction ......................................................................................................................................... 3
Enclosures and hardware components .................................................................................................... 3
General-purpose flexible design ............................................................................................................ 5
Scalable blade form factors ............................................................................................................... 6
Scalable interconnect form factors ...................................................................................................... 8
Star topology ................................................................................................................................... 8
NonStop signal midplane provides flexibility ....................................................................................... 9
Physical layer similarities among I/O fabrics ................................................................................... 9
Connectivity between blades and interconnect modules .................................................................... 9
Blade-to-blade connectivity .......................................................................................................... 11
High bandwidth and performance ....................................................................................................... 12
NonStop signal midplane scalability ................................................................................................ 12
Best practices ............................................................................................................................. 12
Channel topology and equalization set ings .................................................................................. 13
Signal midplane provides reliability .............................................................................................. 14
Separate power backplane ......................................................................................................... 14
Power backplane scalability and reliability........................................................................................ 14
Power and cooling architecture with HP Thermal Logic ........................................................................... 14
Server blades and processors .......................................................................................................... 15
Enclosure ...................................................................................................................................... 15
Dynamic Power Saver Mode........................................................................................................ 15
Active Cool fans ......................................................................................................................... 16
Mechanical design to optimize airflow .......................................................................................... 16
Enclosure Dynamic Power Capping .............................................................................................. 16
Configuration and management technologies ................................................................................ 17
Integrated Lights-Out ....................................................................................................................... 17
Onboard Administrator ...................................................................................................................... 18
HP Insight Control and HP Matrix Operating Environment ................................................................... 18
HP Virtual Connect and Virtual Connect Flex-10 technology .................................................................... 19
Virtual Connect .............................................................................................................................. 20
Virtual Connect Flex-10 ................................................................................................................... 20
...Otros modelos de este manual:
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